TIP #092: Under a component with exposed pad (EP), you may want to place decoupling capacitors the way, that the GND pads will be located under the EP Why? It’s easy to connect them to GND and it keeps current loops small. Note: This is a tip from my new book which I am preparing. … Continue reading TIP #092: Under a component with exposed pad (EP), you may want to … →

Why? So you don’t forget about them until you are ready to create variants. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this form >

Why? Sometimes you may be very limited in space and it can be the only way to place the crystal. Tested on many boards, it works. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this … Continue reading TIP #090: Crystals can be placed also on the opposite side of PCB, just keep the tracks short →

Why? The solder transfers heat to all the pins at once and you can easily remove the component. Do not worry to short all the pins with a lot of solder. It can be easily removed. Note: This is a tip from my new book which I am preparing. If you would like to be … Continue reading TIP #089: When desoldering, don’t be afraid of using a lot of solder →

Why? You do not want to forget them, but you do not want to have them in BOM. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this form >

Why? Sometimes you may need to open two different versions of the same board and you would like to know what version you are looking at. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this … Continue reading TIP #087: Use board version number in the project name and in the PCB file name →

Why? Anyone can simply open and see the schematic. Also, opening a PDF is much quicker than opening a CAD system. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this form >

Why? You can place components under them. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this form >

Why? Heat goes up. Also it may be easier to connect them to one big heatsink. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this form >

Why? For example wrong connect style can make soldering very hard or it can limit maximum current. Note: This is a tip from my new book which I am preparing. If you would like to be notified when this book is ready, just fill out this form >