If you have had to create your own stackup, then you know it takes some time to come up with something good. In this post I would like to share our the most used stackups. Feel free to use them in your projects. Hope it helps.
1. High Density Stackup
Number of Layers: 12
Number of Signal Layers with controlled impedance: 6
Defined Impedance: 55OHM Single Ended, 90 OHM Differential, 100 OHM Differential
(Click to Enlarge)
2. Motherboard Stackup
Number of Layers: 12
Number of Signal Layers with controlled impedance: 4
Defined Impedance: 50OHM Single Ended, 72 / 85 / 90 / 100 OHM Differential
(Click to Enlarge)
3. System on Module Stackup
Number of Layers: 12
Number of Signal Layers with controlled impedance: 4
Defined Impedance: 55OHM Single Ended, 90 OHM Differential, 100 OHM Differential
(Click to Enlarge)
4. System on Module Stackup
Number of Layers: 10
Number of Signal Layers with controlled impedance: 4
Defined Impedance: 50/55OHM Single Ended, 90 OHM Differential
(Click to Enlarge)
5. Advanced Cost Effective Stackup
Number of Layers: 6
Number of Signal Layers with controlled impedance: 3
Defined Impedance: 55OHM Single Ended, 90 OHM Differential, 100 OHM Differential
(Click to Enlarge)
6. Cheap Board Stackup (wide tracks)
Number of Layers: 6
Number of Signal Layers with controlled impedance: 3
Defined Impedance: 55OHM Single Ended, 90 OHM Differential, 100 OHM Differential
(Click to Enlarge)
Hello, I’m trying to use the 5° stackup in the list: Advanced Cost Effective Stackup and I’ve got a question: What substrate is used used in this setup? What got me confused was the Er of the substrate which looks like something else than FR-4. Anyway, thank you for the awesome post and blog.
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I do not know the exact substrate, but it may not be FR-4. You can double check with your PCB manufacturer if they stock materials with similar Er – they may suggest something.
PS: Thank you 🙂
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