Here is the PCB stackup what I normally start with + requirements for minimum VIA, track, clearance and impedances.
- 12 Layers
- L1 – Signal
- L2 – GND
- L3 – Signal
- L4 – Signal
- L5 – GND
- L6 – Powers
- L7 – Powers
- L8 – GND
- L9 – Signal
- L10 – Signal
- L11 – GND
- L12 – Signal
- Required impedances
- Single ended: 50 OHMs (all signal layers)
- Differential: 70, 90 and 100 OHMs (all signal layers)
- Other requirements
- minimum through-hole VIA: 0.45mm (pad) / 0.2mm (drill)
- minimum track / clearance: 0.1 mm / 0.1 mm
(more expensive PCB: 0.075mm / 0.075mm)
- If uVIAs are used
- uVIA: 0.25mm (pad) / 0.1mm (laser drilled hole)
- buried VIA: 0.45mm (pad) / 0.2mm (drill)
I also found useful information about HDI stackups in this Mentor document:
HDI Layer Stackups for Large Dense PCBs
HDI PCB technology comparison (picture from the Mentor document)
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8 thoughts on “PCB stackup example – minimum track, clearance, VIA …”
I have been looking for a PCB Sample. This looks great. I will have to order mine soon to get started!
Where do you manufacture your PCB?
For simple PCBs, we use: http://www.sqpinternational.com
For complicated PCBs, we use: http://www.exceptionpcbsolutions.com/
I hope it helps, Robert
Hi, I’am looking for a book which explain how i can calculate the minimum clearance and all about stack up of a PCB
Minimum clearance depends on what you are routing – have a look at a crosstalk calculator (e.g. https://www.eeweb.com/toolbox/microstrip-crosstalk/). For sensitive signals, you may want to keep the crosstalk coeficient below -30dB. Also, double check with your PCB manufacturer what is the minimum clearance they can do.
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