PCB stackup example – minimum track, clearance, VIA …

Here is the PCB stackup what I normally start with + requirements for minimum VIA, track, clearance and impedances.

  • 12 Layers
    • L1 – Signal
    • L2 – GND
    • L3 – Signal
    • L4 – Signal
    • L5 – GND
    • L6 – Powers
    • L7 – Powers
    • L8 – GND
    • L9 – Signal
    • L10 – Signal
    • L11 – GND
    • L12 – Signal
  • Required impedances
    • Single ended: 50 OHMs (all signal layers)
    • Differential: 70, 90 and 100 OHMs (all signal layers)
  • Other requirements
    • minimum through-hole VIA: 0.45mm (pad) / 0.2mm (drill)
    • minimum track / clearance: 0.1 mm / 0.1 mm
      (more expensive PCB: 0.075mm / 0.075mm)
  • If uVIAs are used
    • uVIA: 0.25mm (pad) / 0.1mm (laser drilled hole)
    • buried VIA: 0.45mm (pad) / 0.2mm (drill)

I also found useful information about HDI stackups in this Mentor document:
HDI Layer Stackups for Large Dense PCBs

HDI PCB technology comparison (picture from the Mentor document)

Please LIKE, Share, ReTweet. Thank you.

8 thoughts on “PCB stackup example – minimum track, clearance, VIA …

  1. Pingback: My Homepage
      1. Hi, I’am looking for a book which explain how i can calculate the minimum clearance and all about stack up of a PCB
        Thanks

        Like

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google photo

You are commenting using your Google account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

Connecting to %s